Published on August 12th, 2011 | by Dan0
>AMD/Intel Pondering Liquid Cooling Solutions
>Rumors have drifted out today that AMD and Intel are both pondering packaging liquid cooling solutions with their next generation of chips.
This would start with AMD’s Bulldozer, coming in September.
It remains to be seen whether these would be any good, as stock coolers in the past have been pretty much crap, especially for the gamer/overclocker. A liquid solution would need to be well made and work, as leaks are obviously a bad thing. I’d imagine this would up the price too. I’d like it if they would ship with liquid or air, depending on your preference.
Details are still unknown right now.